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RELIFE SP-X BGA REBALLING solder paste
In stock
€8.34
Lowest price in the last 30 days: 7.49 €
Tax included
Solder Paste RELIFE SP -X 50g
Specification:
- Manufacturer: RELIFE
- Category: Solder paste
- Color: Silver
- Description: A solder paste specially designed to connect two elements of the motherboard, the so-called sandwiches. It will also work well when placing balls on BGA chips.
- Weight / volume / quantity: 50g
- Melting point: 158 ° C
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