RELIFE SP-X BGA REBALLING solder paste

In stock
€8.34
Lowest price in the last 30 days: 7.49 €

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Solder Paste RELIFE SP -X 50g

Specification:

  • Manufacturer: RELIFE
  • Category: Solder paste
  • Color: Silver
  • Description: A solder paste specially designed to connect two elements of the motherboard, the so-called sandwiches. It will also work well when placing balls on BGA chips.
  • Weight / volume / quantity: 50g
  • Melting point: 158 ° C
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