3D Stencils

3D BGA stencils are precision tools used for CPU, GPU, NAND, RAM, eMMC, and BGA chip reballing. Their three-dimensional design with an integrated handle provides stability and control during the placement of solder balls on chip pads, especially under a microscope.

This category includes:

• 3D stencils with handle for secure and easy use

• double-sided BGA templates for iPhone, Android, baseband chips, memory modules

• universal and chip-specific stencil kits for mobile device repair

• stencils compatible with magnetic holders and preheaters

Perfect for logic board repair, reballing, and SMD chip servicing in GSM workshops and microelectronics labs. These tools are essential for technicians looking for BGA stencils, solder ball templates, and reballing accessories.