2D Stencils

2D BGA stencils are essential tools for reballing CPUs, NAND, RAM, Touch ICs, baseband chips, and other mobile components. These flat, metal solder ball templates ensure accurate and repeatable alignment of solder balls on BGA pads.

In this category, you’ll find:

  • 2D stencils for iPhone chips (A11, A12, A14, A16, etc.)

  • reballing templates for Android ICs and other logic board chips

  • metal stencils for Touch IC, PMIC, Wi-Fi, NAND, EEPROM

  • ideal tools for micro soldering, GSM service, and BGA repair

Perfect for logic board technicians working on iPhone 11–15 Pro Max, Android devices, and small IC components.

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