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Zestaw Sit do reballingu BGA iPhone 8-16PM - 2UUL
Zestaw Sit do reballingu BGA iPhone 8-16PM - 2UUL
2UUL BG01 is a professional set of four reballing stencils (A, B, C, D), designed for BGA repairs in iPhones from the 8 to the 16 Pro Max models. Precise holes and high-quality workmanship guarantee even solder ball application and reliable results.
Thanks to durable, high-temperature-resistant steel and full compatibility with a wide range of iPhone models, the 2UUL BG01 kit is an indispensable tool in professional GSM repair shops and electronics workshops.
zł64.99
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2UUL BG01 – Set of 4 BGA reballing screens for iPhone 8-16 Pro Max
Professional set of **2UUL BG01** reballing templates designed for precise repairs of iPhones from models 8 to 16 Pro Max. The kit consists of four sheets (A, B, C, D), allowing for adjustment to various BGA sizes and ensuring easy repair of processors and chips.
Why choose the 2UUL BG01 kit?
Four precision sheets (A, B, C, D)
The set includes four stencil designs, ensuring compatibility with various BGA chip sizes used in iPhones.
Excellent printing accuracy
Precisely machined holes allow for even solder ball spacing and minimize the risk of assembly errors.
High-quality template material
Made of thin, durable metal or stainless steel material - resistant to the temperature during the reflow process.
Smartphone repair and assembly accessories
The perfect tool for iPhone repair and assembly service technicians and service centers BGA.
Ideal applications:
- BGA reballing in iPhones 8 – 16 Pro Max
- Precise solder ball application
- BGA chip and processor repairs
- Applications in electronics and mobile device repair shops
Technical specifications
Brand / Manufacturer:| Product name: | 2UUL BG01 Reballing Stencil Set (4 pieces) |
| 2UUL | |
| Model range: | iPhone 8 to iPhone 16 Pro Max |
| Number of elements in the set: | 4 (A, B, C, D) |
| Color: | Silver |
| Condition: | New, packed |
Note: This product is an electronic repair tool - please use with caution and appropriate equipment to avoid damaging BGA components during the reflow process.
S2UULRFD30
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