2UUL BG02 AB – Universal BGA Reballing Stencil (0.3 mm / 0.85 Spacing, 2 pcs.)

2UUL BG02 AB is a high-quality universal stencil BGA designed for precise reballing of integrated circuits. Holes with a diameter of 0.3 mm and a spacing of 0.85 mm ensure uniform solder ball formation, resulting in stable and durable connections during motherboard repairs.

Made of durable, thin metal, the matrix guarantees excellent adhesion to the BGA, facilitating solder application and minimizing the risk of shifting. The set includes two pieces, increasing work comfort and allowing for longer, uninterrupted use. An ideal choice for electronics repair shops, mobile phone technicians, and advanced users specializing in BGA repair.