Middle Layer Reballing Handle 13

Middle Layer Reballing Handle 13

Mijing Z20 10 in 1 middle layer reballing handle for iPhone 13 series

A professional holder that allows the middle layer of the iPhone motherboard to be peeled. To connect both parts of the motherboards together (so called sandwich) you need to reballing.

This device allows you to go through this process easily and safely. A perfectly matched sieve will make it possible to avoid problems related to incorrect arrangement of the balls on the PCB.

Kit includes BGA screens

Supported models:

- iPhone 13 mini

- iPhone 13

- iPhone 13 Pro

- iPhone 13 Pro Max

zł169.99
Tax included
Last items in stock 2 Items
Product availability Last remaining items
Delivery options Learn more
Product Details
SMIJGZ2013
2 Items
Reviews(0)

No customer reviews for the moment.

You need to be logged in or create an account to give your appreciation of a review.

Sign in

Megamenu

Compare0My Wishlist0

Your cart

There are no more items in your cart

Cookies

Cookie information

This site uses first party cookies to give you the best experience on our site. We also use third party cookies to improve our services, analyze and then display advertisements related to your preferences based on the analysis of your browsing behavior.

Cookie management

About Cookies

Cookies are small text files that are saved on your computer or mobile device by the websites you visit. They are used for a variety of purposes, such as remembering user login information, tracking user behavior for advertising purposes, and personalizing the user's browsing experience. There are two types of cookies: session and persistent. The former are deleted after the end of the browser session, while the latter remain on the device for a certain period of time or until they are manually deleted.