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Relife RL‑601MA - CPU Reballing Platform iPhone 8 series to 17Pro Max (A11–A19Pro)
Relife RL‑601MA - CPU Reballing Platform iPhone 8 series to 17Pro Max (A11–A19Pro)
RELIFE RL-601MA - iPhone Processor Reballing Platform (A8 to A19 Pro)
RELIFE RL-601MA is an advanced service kit designed for precise tin application planting) for the lower layers of Apple processors. The platform offers comprehensive support for a wide range of systems, from the A8 series to the latest A19 Pro units (iPhone 8 to 17 Pro Max), providing an indispensable tool for CPU reballing repairs.
The device uses a system of strong magnets with high thermal resistance, ensuring automatic and stable mounting of the processor without the risk of it shifting during operation. Precisely crafted stencils made of high-quality steel have laser-cut holes that guarantee perfectly formed solder balls, minimizing the risk of stencil clogging and significantly accelerating the IC reballing process.
zł129.99
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RELIFE RL-601MA – Magnetic iPhone Processor Reballing Platform (A8-A19 Pro)
Why choose the RELIFE RL-601MA kit?
Wide compatibility (A8 to A19 Pro)
The RL-601MA kit is a comprehensive solution supporting almost all generations of Apple processors – from the iPhone 8 to the latest series 17 Pro Max. It supports A11 to A19 Pro chipsets, as well as older A8, A9, and A10 units, making it the most versatile CPU reballing tool on the market.
Precise magnetic positioning
The platform is equipped with a system of strong neodymium magnets that hold the stencil firmly in place. Thanks to precise grooves tailored to specific chips, the processor automatically seats in the perfect position, eliminating misalignment during solder paste application.
High-quality steel stencils
The included stencils are made of high-quality Japanese steel that is resistant to deformation under high temperatures. Laser-cut holes with a square cross-section facilitate the formation of perfect solder balls and prevent paste blockage, which is crucial for densely packed pins in processors.
Overheating Protection and Stability
The base design effectively dissipates excess heat, protecting delicate processor structures from thermal damage. Non-slip feet and the appropriate weight of the device ensure stable operation under the microscope, significantly improving the comfort and effectiveness of swap or flood repairs.
Ideal for:
- Professional reballing of the lower layer of processors (CPU Lower Layer)
- Motherboard repairs in iPhone 8 to iPhone 17 Pro Max models
- Services specializing in advanced microsoldering and recovery data
- Board Swap work requiring the transfer of the processor to a new board
- Ensuring repeatability and the highest quality of BGA connections in GSM services
SRLCP601MA
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