Qianli Mega IDEA iSocket for testing motherboards without soldering

A device from the reputable brand Qianli Mega IDEA that allows you to check the efficiency of the motherboard after the work done without the need to reballing the middle layer (so-called sandwiches).

Thanks to this device, you will save time and minimize the risk of damage to the motherboard. You no longer have to rejoin two parts of the plates to check whether the repair was successful. All you have to do is mount both parts of the board in this platform, connect the necessary components and you can check if everything works.

The device is additionally equipped with the possibility of reballing the middle layer in the iPhone 14 series. Appropriate sieves are included in the set.