QIANLI F1X is a professional intelligent heating platform designed for motherboard repair, desoldering and separation of multi-layer smartphone logic boards.

The device combines a heating module, adjustable motherboard holder and intelligent temperature control system in one compact platform. It is particularly suitable for work requiring stable and repeatable heating conditions during motherboard separation, soldering and desoldering.

Set with 6 Dedicated Heating Modules

The offered set includes 6 dedicated F1X Heating Modules designed for selected iPhone motherboard layouts:

• iPhone 15 / 15 Plus
• iPhone 15 Pro / 15 Pro Max
• iPhone 16 / 16 Plus
• iPhone 16 Pro / 16 Pro Max
• iPhone 17 / 17 Air
• iPhone 17 Pro / 17 Pro Max

The dedicated modules allow the heating surface to be better matched to the specific motherboard, helping provide more precise and controlled heat during board separation and desoldering.

Intelligent Temperature Control

The F1X operates within a 60–280°C temperature range and uses a three-stage temperature process:

• rapid heating,
• stable temperature holding,
• controlled cooling.

This allows the entire desoldering process to be managed more precisely and helps reduce sudden temperature changes during motherboard repair.

Designed for Multi-Layer Motherboards

The platform is intended for professional work involving:

• motherboard layer separation,
• sandwich motherboard desoldering,
• controlled preheating,
• soldering and desoldering,
• smartphone logic board repair.

QIANLI designed the platform to work with dedicated heating modules for individual iPhone models, providing more targeted heating of the required motherboard area.

60 × 90 mm Heating Area

The main heating module provides a 60 × 90 mm heating area, suitable for a wide range of smartphone motherboards.

The heating element is made from aluminum alloy, providing good heat conductivity and distribution across the working surface.

Adjustable Motherboard Holder

The integrated spring-loaded mounting system with sliding guides allows the holder to be adjusted for motherboards of different sizes.

Stable positioning helps prevent the board from moving during heating, soldering and desoldering work.

Color LCD Display

The integrated color LCD displays important operating information, including:

• current temperature,
• selected operating mode,
• device status.

The platform is controlled using the display and a convenient rotary knob.

Quick Temperature Presets

The F1X includes preset temperature values:

60°C / 180°C / 280°C

These presets allow quick switching between commonly used temperature settings.

Two Heating Curve Modes

The platform supports two operating modes:

Standard Curve Mode – standard temperature curve for general service work.

Wave Soldering Curve Mode – a curve designed for more controlled soldering and desoldering processes.

Key Features

• intelligent heating and desoldering platform,
• 6 dedicated heating modules included,
• modules for iPhone 15 through iPhone 17 Pro Max families,
• temperature range: 60–280°C,
• heating area: 60 × 90 mm,
• programmable temperature curves,
• controlled heating, holding and cooling stages,
• color LCD display,
• rotary knob control,
• adjustable motherboard holder,
• spring-loaded mounting system,
• preset temperatures: 60°C / 180°C / 280°C,
• two heating curve modes,
• USB Type-C interface,
• compact professional design.

Specifications

Brand: QIANLI
Model: F1X
Type: Intelligent Heating / Desoldering Platform
Voltage: 220V
Temperature Range: 60–280°C
Heating Area: 60 × 90 mm
Heating Module Material: Aluminum Alloy
Motherboard Holder Material: Synthetic Stone
Control: Color LCD + Rotary Knob
Interface: USB Type-C
Modes: Standard Curve Mode / Wave Soldering Curve Mode
Dimensions: 115 × 134 × 54 mm
Net Weight: 338 g

Package Contents

1 × QIANLI F1X Intelligent Heating Platform

6 × F1X Heating Modules:

• iPhone 15 / 15 Plus
• iPhone 15 Pro / 15 Pro Max
• iPhone 16 / 16 Plus
• iPhone 16 Pro / 16 Pro Max
• iPhone 17 / 17 Air
• iPhone 17 Pro / 17 Pro Max