Holders for reballing
Reballing holders for BGA are specialized tools essential for the precise repair and reballing of Ball Grid Array components. They provide stable and accurate placement of chips during the delicate process of solder ball application and reflow soldering.
Using reballing holders allows you to:
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ensure perfect alignment of BGA chips during solder paste and solder ball application
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securely hold components throughout reballing and soldering processes
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improve the precision and efficiency of repairing BGA, eMMC, NAND, and other SMT components
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work effectively with different layers and types of chips, including processors and memory modules
Our holders are compatible with various BGA stencil models and are indispensable tools for professional GSM repair shops and electronics laboratories.