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Soldering pads for integrated circuits 3 in 1 - WL DT02
Soldering pads for integrated circuits 3 in 1 - WL DT02
WL 3-in-1 is a professional service pad set designed to stabilize and protect circuits during motherboard soldering. Thanks to "explosion-proof" technology, the material exhibits extreme resistance to high temperatures, preventing cracking, chipping, or deformation when working with hot air.
The 3-in-1 design allows for precise seating of various components, such as processors, NAND flash memory, and BGA chips, making it easier to clean off adhesive and re-peen. Made of high-quality thermal insulation materials, the WL pad ensures work safety and increases the efficiency of the most demanding microelectronics repairs.
Set of 3:
10mm x 10mm x 0.8mm
20mm x 18mm x 0.8mm
25mm x 30mm x 0.8mm
zł34.99
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WL 3-in-1 set of pads for servicing BGA chips
WL 3-in-1 is a professional set of service pads, designed for safe and precise work with integrated circuits (BGA, CPU, NAND). Thanks to the use of innovative materials resistant to extreme temperatures, the pads eliminate the risk of chipping and cracking ("explosion-proof"), providing a stable platform for adhesive removal and reballing smartphone motherboards.
Key advantages of the kit:
Exlosion-proof Technology
The pads are made of a special synthetic composite that does not undergo thermal expansion under the influence of the Hot Air station. This prevents sudden cracking of the material, which is crucial for the safety of the technician and the system being repaired.
3-in-1 set for complete versatility
The set consists of three independent blocks with precisely milled slots. Each one is dedicated to different components, such as processors (A-series), NAND memories, and baseband/EEPROM chips.
Effective heat dissipation and insulation
The pad material is characterized by low thermal conductivity, which protects the worktop from damage while allowing for quick and localized heating of the BGA chip itself.
Precise chip stabilization
Thanks to perfectly aligned recesses, the integrated circuit remains stationary during mechanical removal of the hard adhesive (underfill), minimizing the risk of breaking pads on the processor or board.
Example applications
- Cleaning adhesive residue from iPhone processors (A10, A11, A12, A13, and newer)
- Stabilization of chips during reballing and stencil application
- Even stencil pressure during reballing
- Safe desoldering of NAND Flash and PCIE chips
- Service work on baseband and EEPROM modules
- Microsoldering requiring a stable and heat-resistant substrate
The WL 3-in-1 kit is the foundation of a professional microsoldering repair station. Combining the safety of crack-resistant technology with precision workmanship, it allows for the most complex motherboard repairs with the highest efficiency.
SWLDT02PAD
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