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MECHANIC – Brush for removing glue from motherboard chips
MECHANIC – Brush for removing glue from motherboard chips
MECHANIC – Brush for removing glue from motherboard chips
Professional service brush made of ultra-thin steel wire, designed for quick and precise removal of underfill, "black glue," and hard resins around BGA/QFN/PMIC chips.
Highly hard bristles do not deform at high temperatures, making the tool ideal for use with a heater or hot air gun, making cleaning solder pads and circuit edges quicker and easier.
The knurled handle provides a secure grip and movement control, minimizing the risk of damage. Ideal for GSM and electronics repair shops during disassembly, reballing, and PCB cleaning.
zł25.99
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MECHANIC – PCB Glue Removal Brush
Professional Ultra-thin steel wire brush for quick and effective removal of underfill, "black glue," resin, and solder residue from BGA/QFN/PMIC chips. High-temperature resistant – ideal for work with preheating.
High-temperature resistant. Faster cleaning when combined with a heater or hot air.
Key features
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Ultra-fine, hard steel bristles
Effectively breaks down and combs out even hard resins and underfill, making it easier to expose pads and edges of the system.
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High temperature resistance
The bristles do not deform during hot work – they work great with heaters and hot air.
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Fast and effective cleaning
Accelerates the removal of "zinc/glue" and flux residue after reballing or disassembly systems.
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Secure grip and control
The knurled handle ensures stability and precision even with short, pinpoint strokes.
Precise steel bristles and a comfortable, knurled handle.
Applications
- Removing underfill and "black glue" around BGA, QFN, PMIC, CPU, NAND, etc. chips.
- Cleaning edges of chips and solder pads after disassembly/reballing.
- Removing hard solder/resin residue and encrusted flux from PCBs.
Safe Use Tips
- Work in an ESD safe environment, with the power/battery disconnected.
- Soften the adhesive with heat (hot air/heater) and/or IPA/underfill remover.
- Brush with short, gentle strokes from the chip outwards – without excessive pressure.
- Regularly remove filings and debris (they are conductive), and finally wash the area with IPA.
Note: Do not press too hard on the brush to avoid damaging the traces or SMD components.
Specifications
| Manufacturer: | MECHANIC |
| Tool Type: | PCB Glue/Underfill Removal Brush |
| Bristle Material: | Ultra-thin steel wire, high hardness |
| Temperature resistance: | Does not deform when heated; recommended for use with preheaters. |
| Intended use: | BGA/QFN/PMIC chips and other SMD components on motherboards. |
| Color: | Silver and Black |
Package Contents
- 1× MECHANIC Adhesive Removal Brush
SMECHMCGRB
4
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