Mega-Idea iP 16 Middle Layer Reballing Holder
Mega-Idea iP 16 Middle Layer Reballing Holder
Mega-Idea iPhone 16 Middle Layer Reballing Holder
The iPhone 16 series middle layer motherboard reballing kit from MEGA IDEA is a professional tool designed for board-level repairs. The kit includes a high-temperature-resistant stand and two precise BGA stencils for the iPhone 16/16 Plus and 16 Pro/16 Pro Max models. Perfectly matched contours enable quick and accurate application of solder balls to the middle layer. Essential equipment for services specializing in the repair of "sandwich" motherboards.
MEGA IDEA – Reballing Platform iPhone 16 Series
A set designed for precise soldering of the middle layer of the motherboard in the iPhone 16 series. It allows for stable component placement, and thanks to dedicated stencils made of stainless steel, the process of applying BGA balls becomes fast, clean and repeatable.
Kit contents:
- Middle layer stand made of durable material resistant to high temperatures.
- 2 metal stencils:
iPhone 16 / 16 Plus
iPhone 16 Pro / 16 Pro Max
The most important features:
- Compatibility: iPhone 16, 16 Plus, 16 Pro, 16 Pro Max
- High accuracy of fit - precise mapping of middle layer contours
- Durable materials - resistance to temperature and mechanical damage
- Facilitates assembly of the "sandwich" motherboard after separation of layers
- Professional tool for working with hot air or IR
Application:
- Reballing and reconstruction of the middle layer of the motherboard
- Service repairs of Apple motherboards at the micro-soldering level
- Work with BGA balls and fluxes service
Product recommended for professional GSM services that repair electronics and regenerate Apple motherboards. Thanks to it, you gain precision, safety and comfort of work.
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