QianLi 007 Universal Glue Removal Blade
QianLi 007 Universal Glue Removal Blade
QianLi 007 Universal Glue Removal Blade is a specialized tool designed for precise cleaning and removal of adhesive residue from components such as motherboard chips, processors (CPU), hard drives and the adhesive around the base chips.
Ideal for working with delicate electronic components.
Material: Stainless steel and aluminum alloy
Versatile: Perfect for working with Samsung dual-CPU devices and for disassembling iPhone chipsets.
Precise Adhesive Removal: Equipped with a crescent-shaped blade (J Curved Blade) that effectively removes adhesive from CPUs and hard drives.
Safe use: Allows gentle and controlled insertion of the blade while melting the tin, allowing for safe disconnection of processors.
This precision blade is the perfect choice for work in electronics repair shops.
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