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RELIFE SP-X BGA REBALLING solder paste
RELIFE SP-X BGA REBALLING solder paste
Solder Paste RELIFE SP -X 50g
Specification:
- Manufacturer: RELIFE
- Category: Solder paste
- Color: Silver
- Description: A solder paste specially designed to connect two elements of the motherboard, the so-called sandwiches. It will also work well when placing balls on BGA chips.
- Weight / volume / quantity: 50g
- Melting point: 158 ° C
zł35.99
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Safety Information
Health Hazards:
- Contact with eyes may cause irritation.
- Contact with skin may cause irritation.
- Inhalation of vapors is harmful.
- Ingestion may cause gastrointestinal irritation.
Precautions:
Prevention:
- Avoid contact with skin and eyes.
- Avoid inhaling vapors.
- Ensure good ventilation in the work area.
Response:
- In case of contact with skin (or hair): immediately remove all contaminated clothing. Wash skin/shower with water.
- In case of eye contact: rinse thoroughly with water for several minutes.
- In case of inhalation: move to fresh air.
- In case of accidental ingestion: gargle. Do not induce vomiting.
Storage:
- Store in a well-ventilated place.
Disposal:
- Contents and packaging must be disposed of in accordance with national regulations.
SRESPX0000
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