YCS BQ-03 PCB/IC Glue Removal Pry Knife Set – 2 pcs

YCS BQ-03 is a set of two precision service tools designed for motherboard repair and work with small electronic components.

The BQ-03A and BQ-03B knives feature different blade profiles, allowing them to be used for adhesive removal, surface cleaning and controlled lifting of CPU, IC and BGA chips.

Non-magnetic steel

The blades are made of non-magnetic steel, making the tools suitable for precise work around sensitive electronic components.

The material offers high hardness, durability and resistance to wear during everyday service work.

Two different blade profiles

The set includes two knives with different tip shapes.

BQ-03A features a rounded and profiled blade designed for lifting components and working underneath chips.

BQ-03B features a flat end and a precision tip suitable for scraping, cleaning and removing adhesive from difficult-to-reach areas.

The different blade shapes allow the technician to select the right tool for a specific repair task.

CPU and IC adhesive removal

The knives are suitable for removing:

• black adhesive used around chips,

• adhesive residue from motherboards,

• adhesive around CPU and IC chips,

• edge adhesive,

• remaining bonding material after chip removal.

The precision blades allow controlled work in tight spaces between motherboard components.

Lifting chips and components

YCS BQ-03 can also be used for carefully lifting:

• CPU chips,

• IC and BGA chips,

• shields and covers,

• motherboard components,

• back covers and small housing elements.

Hand-polished blades

The blades are hand-polished, providing a smooth working surface and precise edge finish.

The design is intended for repair work requiring accuracy and good control over the tool.

Comfortable grip

The red handles provide a secure grip during precision service operations.

Their slim profile makes it easier to control pressure and guide the blade while working with small components.

Protective case

The set includes a fitted protective case for safe storage of both knives and protection of the blades against accidental damage.

Applications

YCS BQ-03 is suitable for:

• smartphone and tablet motherboard repair,

• removing adhesive from under and around CPU/IC chips,

• preparing chips for further repair work,

• lifting BGA chips,

• cleaning adhesive residue,

• opening and disassembling small electronic components,

• precision work in GSM and electronics repair shops.

Specifications

• Manufacturer: YCS

• Model: BQ-03

• Set components: BQ-03A + BQ-03B

• Type: adhesive removal and pry knife set

• Blade material: non-magnetic steel

• BQ-03A dimensions: approx. 159 × 9 mm

• BQ-03B dimensions: approx. 152 × 9 mm

• BQ-03A weight: approx. 12 g

• BQ-03B weight: approx. 11 g

• Case dimensions: approx. 176 × 38 × 19 mm

• Number of knives: 2 pcs.

• Protective case: yes

YCS BQ-03 – two tools for precision repair work

The combination of two different blade profiles, non-magnetic steel and compact construction makes the YCS BQ-03 a practical set for everyday adhesive removal and motherboard chip handling.