MEGA IDEA – Reballing Platform iPhone 16 Series

A kit designed for precise soldering of the middle layer of the motherboard in the iPhone 16 series. It enables stable component placement, and thanks to dedicated stencils made of stainless steel, the BGA ball application process becomes quick, clean, and repeatable.

Kit Contents:

• Middle layer stand made of durable, high-temperature-resistant material.
• 4 metal stencils:

  iPhone 17, iPhone 17 Air, iPhone 17Pro, iPhone 17Pro Max

The Most Important Features:

• Compatibility: iPhone 17, 17 Air, 17 Pro, 17 Pro Max
• High-precision fit – precise mapping of the middle layer contours
• Durable materials – resistance to temperature and mechanical damage
• Facilitates the assembly of a "sandwich" motherboard after separating the layers
• Professional tool for working with hot air or IR

Applications:

• Reballing and reconstruction of the middle layer of the motherboard
• Service repairs of Apple motherboards at the micro-soldering level
• Working with BGA balls and fluxes service centers

This product is recommended for professional GSM service centers that repair electronics and refurbish Apple motherboards. It provides precision, safety, and work comfort.