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MR YANG - Magnetyczna mata silikonowa do reballingu układów BGA
MR YANG - Magnetyczna mata silikonowa do reballingu układów BGA
Magnetic Silicone Mat for BGA Reballing
Specialized silicone pad designed for precise tin planting on BGA chips. Thanks to the use of strong magnets, the mat holds the screens and components securely, eliminating the risk of shifting when working with processors, NAND flash drives, or integrated circuits in phones and laptops.
The product is characterized by exceptional resistance to high temperatures, preventing deformation and blistering during soldering. A special structure with heat dissipation holes protects the screens from bulging, while the non-slip surface and dedicated slots for chips of various thicknesses significantly increase the efficiency of professional service repairs.
zł44.99
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Magnetic silicone mat for reballing and servicing BGA chips
Innovative, high-temperature silicone mat designed for precise reballing and servicing of integrated circuits. Thanks to integrated strong magnets and a specialized structure, this pad redefines the standards of tin planting, providing unparalleled stability and component protection during soldering processes.
Professional reballing support
Key Advantages
Strong Magnetic Support
Built-in magnets with high attractive force firmly hold the reballing screens in place, eliminating the risk of them shifting during solder paste application or heating, significantly improving work precision.
High thermal resistance
The mat is made of the highest quality silicone resistant to extreme temperatures. It does not deform, swell, or emit odors even when in direct contact with hot air (Hot-Air).
Innovative heat dissipation
Specially designed holes and a surface structure prevent the screens from bulging under the influence of heat, ensuring perfectly flat and even application of the tin beads to the chip.
Versatile chip slots
The pad has dedicated recesses of varying depths that perfectly stabilize processors, NAND flash drives, and other integrated circuits of varying thickness.
Durability and ergonomics
The flexible material is resistant to corrosion, wear, and easy to keep clean. The non-slip base ensures the mat holds securely on the worktop.
Example Applications
- Advanced BGA reballing in smartphones (iPhone, Android)
- NAND memory, CPU, and baseband servicing
- Precise magnetic screen positioning during tinning
- Working with hot-air stations and soldering irons arrowheads
- Professional electronics laboratories and micro-soldering services
Technical specifications
| Manufacturer / Model | YCS Mr. Yang |
| Product Type | Magnetic Tin Planting Pad |
| Material | High Temperature Silicone + Magnets |
| Properties thermal | High temperature resistance (no deformation) |
| Compatibility | BGA chips, processors, memories, magnetic screens |
| Special applications | Anti-Drumming Screen Protection |
A key accessory for technicians striving for micro-soldering perfection. Eliminates common reballing problems, such as screen shifting and overheating, making the repair process faster and more predictable.
SMYSMAGBGA
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